In Situ Device‐Level TEM Characterization Based on Ultra‐Flexible Multilayer MoS<sub>2</sub> Micro‐Cantilever (Adv. Mater. 28/2023)

Authors: Chaojian Hou, Kun Wang, Wenqi Zhang, Donglei Chen, Xiaokai Wang, Lu Fan, Chunyang Li, Jing Zhao, Lixin Dong

Published: 2023-07-14

DOI: 10.1002/adma.202370199

Source: Full article

Abstract

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