Heterostructure conductive interface and melt-penetration-bonding process to afford all-solid-state Li–FeF<sub>3</sub> garnet batteries with high cathode loading

Authors: Hailong Wu, Jiulin Hu, Songlin Yu, Chilin Li

Published: 2024-11-28

DOI: 10.1039/d4ee02947j

Source: Full article

Abstract

A hot melt-penetration-bonding process of ionic wires is developed to address the issues of high contact impedance at cathode/garnet interface and insufficient conduction in bulk cathode.