3D Copper Circuits: Form‐Factor Free 3D Copper Circuits by Surface‐Conformal Direct Printing and Laser Writing (Adv. Funct. Mater. 45/2020)

Authors: Yejin Jo, Hye Jin Park, Young‐Bin Kim, Sun Sook Lee, Su Yeon Lee, Sun‐Kyung Kim, Youngmin Choi, Sunho Jeong

Published: 2020-11-04

DOI: 10.1002/adfm.202070299

Source: Full article

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Abstract

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