Joint‐Inspired Liquid and Thermal Conductive Interface for Designing Thermal Interface Materials with High Solid Filling yet Excellent Thixotropy (Adv. Funct. Mater. 14/2023)

Authors: Zilong Xie, Zhengli Dou, Die Wu, Xiangtong Zeng, Yuan Feng, Yunfei Tian, Qiang Fu, Kai Wu

Published: 2023-04-04

DOI: 10.1002/adfm.202370082

Source: Full article

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Abstract

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