Correction to “Solvent-Assisted Filling of Liquid Metal and Its Selective Dewetting for the Multilayered 3D Interconnect in Stretchable Electronics”

Authors: Woojin Jung, Gyan Raj Koirala, Ju Seung Lee, Jong Uk Kim, Byeonghak Park, Young Jin Jo, Chanho Jeong, Haeleen Hong, Kiyoon Kwon, Yeong-sinn Ye, Jiwon Kim, Kanghyuk Lee, Tae-il Kim

Published: 2023-02-10

DOI: 10.1021/acsnano.3c00500

Source: Full article

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