Recyclable Low Dielectric Polymers with High Thermal Conductivity for Copper‐Clad Laminated Film for High‐Frequency Applications (Adv. Funct. Mater. 26/2025)

Authors: Hyeyoon Ko, Youngjae Wi, Jahyeon Koo, Minwoo Rim, Jaeseok Hyeong, Myong Jae Yoo, Yongchae Jeong, Girdhari Chaudhary, Dong‐Gue Kang, Kwang‐Un Jeong

Published: 2025-06-30

DOI: 10.1002/adfm.202570156

Source: Full article

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Abstract

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