Wafer-scale platform for on-chip 3D radio frequency lumped passive components using metal self-rolled-up membrane technique

Authors: Zhikun Zhou, Zihan Zhang, Hanlin Zhang, Xianchao Wei, Wei He, Quhuan Shen, Xiuwen Bi, Tao Yuan, Xiaochen Chen, Lei Sang, Wen Huang

Published: 2025-03-13

DOI: 10.1038/s41467-025-57769-8

Source: Full article

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Abstract

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