Authors: Zhe Liu, Sarah E. Sofia, Hannu S. Laine, Michael Woodhouse, Sarah Wieghold, Ian Marius Peters, Tonio Buonassisi
Published: 2019-10-25
DOI: 10.1039/C9EE02452B
Source: Full article
This technoeconomic analysis revisits the concept of thin silicon wafer for its potential cost benefits and technological challenges.