Exceptional metallurgical bonding mechanism via Nano-thick layer of interfacial solid solution in dissimilar welding

Authors: Xuebin Zhuo, Haining Yao, Ke Chen, Katsuyoshi Kondoh, Liming Peng, Min Wang, Xueming Hua, Aidang Shan

Published: 2025-06-03

DOI: 10.1016/j.jma.2025.05.007

Source: Full article

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Abstract

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